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IEC 60286-3 Ed. 7.0 b:2022

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
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IEC 60286-3 Ed. 7.0 b:2022

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

PUBLISH DATE 2022
PAGES 113
IEC 60286-3 Ed. 7.0 b:2022
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
IEC 60286-3:2022 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition:
  1. addition terms and definitions.
  2. addition of a table of the classification to symbols concerning drive hole diameter and distance between the reel hole centre and the drive hole centre;
  3. addition of drive hole to the reel (optional);
  4. revision of reel hole diameter tolerances;
  5. revision of 72 mm tape size carrier tape width dimension tolerances;
  6. addition of Annex B (informative);
  7. addition of component size 0201M.
SDO IEC: International Electrotechnical Commission
Document Number IEC 60286
Publication Date Dec. 1, 2022
Language b - English & French
Page Count 113
Revision Level 7.0
Supercedes
Committee 40
Publish Date Document Id Type View
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Dec. 1, 2022 Revision
Dec. 1, 2022 IEC 60286-3 Ed. 7.0 b:2022 Revision