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IEC 61189-5-503 Ed. 1.0 en:2017

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
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IEC 61189-5-503 Ed. 1.0 en:2017

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

PUBLISH DATE 2017
PAGES 28
IEC 61189-5-503 Ed. 1.0 en:2017

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

IEC 61189-5-503:2017(E) specifies the conductive anodic filament (hereafter referred to as CAF).

It specifies not only the steady-state temperature and humidity test, but also a temperature-humidity cyclic test and an unsaturated pressurized vapour test (HAST).

SDO IEC: International Electrotechnical Commission
Document Number IEC 61189
Publication Date May 1, 2017
Language en - English
Page Count
Revision Level 1.0
Supercedes
Committee 91
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