IPC ECA/IPC/JEDEC-J-STD-075

Current Revision

Classification of Passive and Solid State Devices for Assembly Processes

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IPC ECA/IPC/JEDEC-J-STD-075

Name: IPC ECA/IPC/JEDEC-J-STD-075 – Classification of Passive and Solid State Devices for Assembly Processes
Brand: IPC by Global Electronics Association
SKU: IPC ECA/IPC/JEDEC-J-STD-075
Price: 149.00 USD
Availability: InStock

Classification of Passive and Solid State Devices for Assembly Processes

Classification of Non-IC Electronic Components for Assembly Processes

This is the German Language version of the J-STD-075.

J-STD-075 picks up where J-STD-020 left off by providing test methods to classify worst-case thermal process limitations for electronic components. Classification is referenced to common industry wave and reflow solder profiles including lead-free processing. The classifications represent maximum process sensitivity levels and do not establish rework conditions or recommended processes for an assembler. It outlines a process to classify and label non-semiconductor electronic component’s Process Sensitivity Level (PSL) and Moisture Sensitivity Level (MSL) consistent with the semiconductor industry’s classification levels (J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Devices and J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). This standard supersedes IPC-9503. Developed by ECA, IPC and JEDEC. 12 pages. Released August 2008.