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IPC-4562B

Specification for Metal Base Copper Clad Laminates for Printed Boards
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IPC-4562B

Specification for Metal Base Copper Clad Laminates for Printed Boards

PUBLISH DATE 2023
IPC-4562B
Specification for Metal Base Copper Clad Laminates for Printed Boards
IPC-4562A standard covers metal unsupported foils and foils supported by carrier films suitable for subsequent use in printed boards. IPC-4562B addresses the requirements of metal foils used in printed wiring applications.
SDO IPC: IPC by Global Electronics Association
Document Number 4562
Publication Date Oct. 1, 2023
Language en - English
Page Count 40
Revision Level B
Supercedes
Committee
Publish Date Document Id Type View
Oct. 1, 2023 IPC-4562B Revision
May 30, 2008 IPC-4562A Revision
Not Available IPC-4562 Revision
Jan. 1, 2016 IPC-4562A-WAM1 Consolidated
Not Available IPC-4562A Revision