Logo
Login Sign Up
Current Revision

ISO 9455-17:2024

Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
Best Price Guarantee
Instant

$222.00

2-5 Days

$222.00

SAVE 15%

$377.40


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


or

This document specifies a method of testing for deleterious effects that can arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) or Sn95,5Ag3Cu0,5 or other lead-free solders as agreed between user and supplier (see ISO 9453).

This test method is also applicable to fluxes for use with lead-containing and lead-free solders. However, the soldering temperatures can be adjusted with agreement between tester and customer.

SDO ISO: International Organization for Standardization
Document Number ISO 9455
Publication Date Jan. 1, 2024
Language en - English
Page Count
Revision Level
Supercedes
Committee ISO/TC 44/SC 12
Publish Date Document Id Type View
Jan. 1, 2024 ISO 9455-17:2024 Revision