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BSI PD IEC TR 61191-7:2020

Printed board assemblies -- Technical cleanliness of components and printed board assemblies
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BSI PD IEC TR 61191-7:2020

Printed board assemblies -- Technical cleanliness of components and printed board assemblies

PUBLISH DATE 2020
PAGES 118
BSI PD IEC TR 61191-7:2020

This part of IEC 61191 serves as a Technical Report and provides information, how technical cleanliness can be assessed within the electronics assembly industry. Technical cleanliness concerns sources, analysis, reduction and control as well as associated risks of particulate matter, so-called foreign-object debris, on components and electronic assemblies in the electronics industry.

SDO BSI: British Standards Institution
Document Number IEC TR 61191-7
Publication Date March 23, 2020
Language en - English
Page Count 118
Revision Level
Supercedes
Committee EPL/501
Publish Date Document Id Type View
March 23, 2020 PD IEC TR 61191-7:2020 Revision