Logo
Login Sign Up
Historical Revision

IPC-7095A

Design and Assembly Process Implementation for BGAs
Best Price Guarantee
Instant

$198.00


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


or
IPC by Global Electronics Association Logo

IPC-7095A

Design and Assembly Process Implementation for BGAs

PUBLISH DATE 2004
IPC-7095A
Design and Assembly Process Implementation for BGAs
Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. Revision A of this document delivers useful and practical information to anyone who is currently using BGAs or is considering a conversion to area array packaging formats. In addition to providing guidelines for BGA inspection and repair, IPC-7095A also addresses reliability issues and the use of lead free joint criteria associated with BGAs. There are many new photographs of X-ray or endoscope illustrations to identify some of the chracteristics that the industry is experiencing in the implementation of BGA assembly processes. The effect of BGA and FBGA on current technology and component types is also discussed.
SDO IPC: IPC by Global Electronics Association
Document Number 7095
Publication Date Oct. 1, 2004
Language en - English
Page Count
Revision Level A
Supercedes
Committee
Publish Date Document Id Type View
Sept. 12, 2024 IPC 7095E Revision
Jan. 28, 2013 IPC-7095C Revision
April 2, 2008 IPC-7095B Revision
Oct. 1, 2004 IPC-7095A Revision
Aug. 1, 2000 IPC-7095 Revision
June 1, 2019 IPC-7095D-WAM1 Consolidated
Not Available IPC-7095C Revision
Not Available IPC-7095D-WAM1 Consolidated
Not Available IPC-7095D-WAM1 Consolidated