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BSI BS EN 61190-1-2:2007

Attachment materials for electronic assembly -- Requirements for soldering pastes for high-quality interconnects in electronics assembly
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BSI BS EN 61190-1-2:2007

Attachment materials for electronic assembly -- Requirements for soldering pastes for high-quality interconnects in electronics assembly

PUBLISH DATE 2007
PAGES 22
BSI BS EN 61190-1-2:2007
IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.
SDO BSI: British Standards Institution
Document Number EN 61190-1-2
Publication Date July 31, 2007
Language en - English
Page Count 22
Revision Level
Supercedes
Committee EPL/501
Publish Date Document Id Type View
June 30, 2014 BS EN 61190-1-2:2014 Revision
July 31, 2007 BS EN 61190-1-2:2007 Revision
Aug. 12, 2002 BS EN 61190-1-2:2002 Revision