Logo
Login Sign Up
Current Revision

BSI BS EN 61190-1-2:2014

Attachment materials for electronic assembly -- Requirements for soldering pastes for high-quality interconnects in electronics assembly
Best Price Guarantee
Instant

$319.84

2-5 Days

$319.84

SAVE 10%

$575.71


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


or
British Standards Institution Logo

BSI BS EN 61190-1-2:2014

Attachment materials for electronic assembly -- Requirements for soldering pastes for high-quality interconnects in electronics assembly

PUBLISH DATE 2014
PAGES 26
BSI BS EN 61190-1-2:2014
IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition:
a) modification of the solder powder size in Table 2;
b) addition of the information of 'Reflow condition and profile' in Annex B;
c) addition of a new Annex C.
SDO BSI: British Standards Institution
Document Number EN 61190-1-2
Publication Date June 30, 2014
Language en - English
Page Count 26
Revision Level
Supercedes
Committee EPL/501
Publish Date Document Id Type View
June 30, 2014 BS EN 61190-1-2:2014 Revision
July 31, 2007 BS EN 61190-1-2:2007 Revision
Aug. 12, 2002 BS EN 61190-1-2:2002 Revision