IPC-7711/21C

Current Revision
Rework, Modification and Repair of Electronic Assemblies Redline


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IPC-7711/21C

Rework, Modification and Repair of Electronic Assemblies Redline

IPC-7711/21C
Rework, Modification and Repair of Electronic Assemblies
This guide provides procedures for rework, repair and modification of printed board assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures.
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