Uninterruptible power systems (UPS) - Part 5-3: DC output UPS - Performance and test requirements

Transformers, power supplies, reactors and similar products - EMC requirements

Cores made of soft magnetic materials - Measuring methods - Part 1: Generic specification

Cores made of soft magnetic materials - Measuring methods - Part 2: Magnetic properties at low excitation level

Cores made of soft magnetic materials - Measuring methods - Part 3: Magnetic properties at high excitation level

Safety of machinery - Application of protective equipment to detect the presence of persons

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems

Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures

Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses

Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes

Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area

Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures

Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices

Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature