Logo
Login Sign Up
Current Revision

IEC 62047-14 Ed. 1.0 b:2012

Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
Best Price Guarantee
Instant

$189.00

2-5 Days

$189.00

SAVE 10%

$340.20


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


or
International Electrotechnical Commission Logo

IEC 62047-14 Ed. 1.0 b:2012

Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials

PUBLISH DATE 2012
PAGES 38
IEC 62047-14 Ed. 1.0 b:2012
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials
IEC 62047-14:2012 describes definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 ÎĽm to 300 ÎĽm. The metallic film materials described herein are typically used in electric components, MEMS and micro-devices. When metallic film materials used in MEMS (see 2.1.2 of IEC 62047-1:2005) are fabricated by a forming process such as imprinting, it is necessary to predict the material failure in order to increase the reliability of the components. Through this prediction, the effectiveness of manufacturing MEMS components by a forming process can also be improved, because the period of developing a product can be reduced and manufacturing costs can thus be decreased. This standard presents one of the prediction methods for material failure in imprinting process.
SDO IEC: International Electrotechnical Commission
Document Number IEC 62047
Publication Date Feb. 1, 2012
Language b - English & French
Page Count
Revision Level 1.0
Supercedes
Committee 47F
Publish Date Document Id Type View
Feb. 1, 2012 IEC 62047-14 Ed. 1.0 b:2012 Revision
Feb. 1, 2012 Revision