A collection of featured documents from our library that are popular among our users or otherwise noteworthy.
Design Guide for the Packaging of High Speed Electronic Circuit
Design Standard for Printed Electronics on Flexible Substrates
Design Standard for Printed Electronics on Rigid Substrates
International Standard for Digital Twins
Generic Requirements for Electronic Manufacturing Supply Chain Communication - Product Data eXchange (PDX)
Connected Factory Exchange (CFX)
Generic Requirements for Electronic Product Documentation
Specification for Rigid Substrates for Additive Process Printed Boards
Electroless Copper Film for Additive Printed Boards
Specification for High Density Interconnect (HDI) and Microvia Materials
Specification for Finished Fabric Woven from "E" Glass for Printed Boards
Specification for Immersion Tin Plating for Printed Circuit Boards
Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
Requirements for Printed Electronics Functional Conductive Materials
Requirements for Printed Electronics Functional Dielectric Materials
Requirements for Printed Electronics Base Materials (Substrates)
Design, Critical Process and Acceptance Requirements for Polymeric Applications
Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards
Qualification and Performance Specification for Printed Boards Containing Embedded Active and Passive Circuitry
Qualification and Performance Specification for Printed Electronics on Rigid Substrates
Qualification and Performance Specification for Printed Electronics on Flexible Substrates
Terms and Definitions for the Design and Manufacture of Printed Electronics
Design and Assembly Process Implementation of 3D Components
Design and Assembly Process Implementation for Embedded Circuitry
Design and Assembly Process Implementation for Flip Chip and Die-Size Components