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IPC/JEDEC-J-STD-033C-1

Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
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IPC/JEDEC-J-STD-033C-1

Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

PUBLISH DATE 2014
IPC/JEDEC-J-STD-033C-1
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
Provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. These procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC. 18 pages.
SDO IPC: IPC by Global Electronics Association
Document Number J033
Publication Date Aug. 1, 2014
Language en - English
Page Count
Revision Level C
Supercedes
Committee
Publish Date Document Id Type View
March 1, 2018 IPC/JEDEC J STD 033D Revision
Feb. 3, 2012 IPC/JEDEC J-STD-033C Revision
Jan. 4, 2006 IPC/JEDEC J-STD-033B Revision
Aug. 21, 2002 IPC/JEDEC J-STD-033A Revision
April 1, 1999 IPC/JEDEC J-STD-033 Revision
Aug. 1, 2014 IPC/JEDEC-J-STD-033C-1 Consolidated
Not Available IPC/JEDEC-J-STD-033D Revision
Not Available IPC/JEDEC-J-STD-033D Revision
Not Available IPC/JEDEC-J-STD-033D Revision
Not Available IPC/JEDEC-J-STD-033C Revision
Not Available IPC/JEDEC-J-STD-033C Revision
Not Available IPC/JEDEC-J-STD-033C Revision
Not Available IPC/JEDEC-J-STD-033B.1 Revision
Not Available IPC/JEDEC-J-STD-033B.1 Revision