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IEC 61190-1-1 Ed. 1.0 b:2002

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
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IEC 61190-1-1 Ed. 1.0 b:2002

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

PUBLISH DATE 2026
PAGES 50
IEC 61190-1-1 Ed. 1.0 b:2002
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.
SDO IEC: International Electrotechnical Commission
Document Number IEC 61190
Publication Date April 1, 2026
Language b - English & French
Page Count 50
Revision Level 1.0
Supercedes
Committee 91
Publish Date Document Id Type View
April 1, 2026 IEC 61190-1-1 Ed. 1.0 b:2002 Revision
March 1, 2002 Revision