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IEC 61191-2 Ed. 3.0 b:2017

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
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IEC 61191-2 Ed. 3.0 b:2017

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

PUBLISH DATE 2026
IEC 61191-2 Ed. 3.0 b:2017
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
IEC 61191-2:2017 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).
This edition includes the following significant technical changes with respect to the previous edition:
a) the requirements have been updated to be compliant with the acceptance criteria in IPC A-610F;
b) some of the terminology used in the document has been updated;
c) references to IEC standards have been corrected;
d) five termination styles have been added.
The contents of the corrigendum of September 2019 have been included in this copy.
SDO IEC: International Electrotechnical Commission
Document Number IEC 61191
Publication Date April 1, 2026
Language b - English & French
Page Count
Revision Level 3.0
Supercedes
Committee 91
Publish Date Document Id Type View
April 1, 2026 IEC 61191-2 Ed. 3.0 en:2017 Revision
May 1, 2017 Revision
April 1, 2026 IEC 61191-2 Ed. 3.0 b:2017 Revision
June 5, 2024 Revision