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IEC 61191-2 Ed. 3.0 en:2017

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
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IEC 61191-2 Ed. 3.0 en:2017

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

PUBLISH DATE 2017
PAGES 38
IEC 61191-2 Ed. 3.0 en:2017

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

IEC 61191-2:2017(E) gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).

This edition includes the following significant technical changes with respect to the previous edition:

  • a) the requirements have been updated to be compliant with the acceptance criteria in IPC A-610F;
  • b) some of the terminology used in the document has been updated;
  • c) references to IEC standards have been corrected;
  • d) five termination styles have been added.
SDO IEC: International Electrotechnical Commission
Document Number IEC 61191
Publication Date May 1, 2017
Language en - English
Page Count
Revision Level 3.0
Supercedes
Committee 91
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