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A collection of featured documents from our library that are popular among our users or otherwise noteworthy.
Requirements for Sintering Materials for Electrical and Thermal Interconnects
Generic Performance Specification for Printed Boards
Space and Military Avionics Applications Addendum to IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards
Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Requirement and Acceptance for Organic IC Substrates
Design and Assembly Process Implementation for Bottom Termination Components (BTCs)
Design and Assembly Process Implementation for BGAs
Generic Requirements for Surface Mount Design and Land Pattern Standard
Stencil Design Guidelines
Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
Rework, Modification and Repair of Electronic Assemblies
Reflow Oven Process Control Standard
Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
Printed Circuit Assembly Strain Gage Test Guideline
Press-fit Standard for Automotive Requirements and other High-Reliability Applications
Acceptance Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies
User's Guidelines for Automated Solder Joint Inspection Systems
Assembly & Joining Handbook
General Requirements and Test Methods for Electronic Grade Solder Paste
