Logo
Login Sign Up
Current Revision

IPC-2223E

Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
Best Price Guarantee
Instant

$198.00

2-5 Days

$233.00

SAVE 10%

$387.90


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


or
IPC by Global Electronics Association Logo

IPC-2223E

Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

PUBLISH DATE 2020
IPC-2223E
Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
IPC-2223E used in conjunction with IPC-2221, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. IPC-2223E provides new design guidance and requirements for fabrication drawings, hole to edge spacing, bend area conductor considerations, dielectric thickness between rigid and flexible regions and dual row zero insertion force (ZIF) connectors.
SDO IPC: IPC by Global Electronics Association
Document Number 2223
Publication Date Jan. 1, 2020
Language en - English
Page Count 60
Revision Level E
Supercedes
Committee
Publish Date Document Id Type View
Jan. 1, 2020 IPC-2223E Revision
Sept. 1, 2016 IPC-2223D Revision
Dec. 5, 2011 IPC-2223C Revision
Not Available IPC-2223B Revision
Not Available IPC-2223A Revision
Not Available IPC-2223 Revision
Not Available IPC-2223E Revision
Not Available IPC-2223C DE Revision
Not Available IPC-2223C CN Revision
Not Available IPC-2223B DE Revision
Not Available IPC-2223A Revision