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BSI BS EN 61188-5-5:2007

Printed boards and printed board assemblies. Design and use -- Attachment (land/joint) considerations. Components with gull- wing leads on four sides
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BSI BS EN 61188-5-5:2007

Printed boards and printed board assemblies. Design and use -- Attachment (land/joint) considerations. Components with gull- wing leads on four sides

PUBLISH DATE 2007
PAGES 46
BSI BS EN 61188-5-5:2007
IEC 61188-5-5:2007 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on four sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints.

This publication is to be read in conjunction with IEC 61188-5-1 :2002.
SDO BSI: British Standards Institution
Document Number EN 61188-5-5
Publication Date Dec. 31, 2007
Language en - English
Page Count 46
Revision Level
Supercedes
Committee EPL/501
Publish Date Document Id Type View
Dec. 31, 2007 BS EN 61188-5-5:2007 Revision