Logo
Login Sign Up
Current Revision

BSI BS EN 61188-5-8:2008

Printed boards and printed board assemblies. Design and use -- Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)
Best Price Guarantee
Instant

$374.98

2-5 Days

$374.98

SAVE 10%

$674.96


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


or
British Standards Institution Logo

BSI BS EN 61188-5-8:2008

Printed boards and printed board assemblies. Design and use -- Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)

PUBLISH DATE 2008
PAGES 34
BSI BS EN 61188-5-8:2008
IEC 61188-5-8:2007 provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing and reworking of those solder joints.

This publication is to be read in conjunction with IEC 61188-5-1:2002.
SDO BSI: British Standards Institution
Document Number EN 61188-5-8
Publication Date May 30, 2008
Language en - English
Page Count 34
Revision Level
Supercedes
Committee EPL/501
Publish Date Document Id Type View
May 30, 2008 BS EN 61188-5-8:2008 Revision