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BSI BS EN 61192-3:2003

Workmanship requirements for soldered electronic assemblies -- Through-hole mount assemblies
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BSI BS EN 61192-3:2003

Workmanship requirements for soldered electronic assemblies -- Through-hole mount assemblies

PUBLISH DATE 2003
PAGES 50
BSI BS EN 61192-3:2003
Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.
SDO BSI: British Standards Institution
Document Number EN 61192-3
Publication Date April 7, 2003
Language en - English
Page Count 50
Revision Level
Supercedes
Committee EPL/501
Publish Date Document Id Type View
April 7, 2003 BS EN 61192-3:2003 Revision