Radio-frequency connectors - Part 25: Two-pole screw (3/4-20 UNEF) coupled connectors for use with shielded balanced cables having twin inner conductors with inner diameter of outer conductor 13,56 mm (0,534 in) (Type TWHN)

Radio-frequency connectors - Part 27: Radio-frequency coaxial connectors with screw coupling, typically for use in 75 ohms cable distribution systems (Type E)

Radio-frequency connectors - Part 28: Radio-frequency coaxial connectors with inner diameter of outer conductor of 5,60 mm (0,220 in) with snap-on coupling - Characteristic impedance 75 ohms

Radio-frequency connectors. Part 3: Two-pin connector for twin balanced aerial feeders

Radio-frequency connectors. Part 5: R.F. coaxial connectors for cables 96 IEC 50-17 and larger

Radio-frequency connectors. Part 6: R.F. coaxial connectors for cables 96 IEC 75-17 and larger

Radio-frequency connectors. Part 7: R.F. coaxial connectors with inner diameter of outer conductor 9.5 mm (0.374 in) with bayonet lock - Characteristic impedance 50 ohms (Type C)

Radio-frequency connectors. Part 9: R.F. coaxial connectors with inner diameter of outer conductor 3 mm (0.12 in) with screw coupling - Characteristic impedance 50 ohms (Type SMC)

Test procedure for the determination of the temperature index of enamelled and tape wrapped winding wires

Guidance for the selection of high-voltage A.C. cable systems

High-pressure mercury vapour lamps - Performance specifications

Low-frequency cables and wires with PVC insulation and PVC sheath - Part 1: General test and measuring methods

Low-frequency cables and wires with PVC insulation and PVC sheath - Part 2: Cables in pairs, triples, quads and quintuples for inside installations

Low-frequency cables and wires with PVC insulation and PVC sheath - Part 3: Equipment wires with solid or stranded conductor wires, PVC insulated, in singles, pairs and triples

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

Mechanical standardization of semiconductor devices. Part 2: Dimensions

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA