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IEC 60191-6-13 Ed. 2.0 b:2016

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
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IEC 60191-6-13 Ed. 2.0 b:2016

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

PUBLISH DATE 2016
PAGES 40
IEC 60191-6-13 Ed. 2.0 b:2016

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

IEC 60191-6-13:2016 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA.

This edition includes the following significant technical changes with respect to the previous edition:

  • BGA package nominal length and width have been newly expanded to 43 mm and 43 mm, respectively.
  • Accordingly, six socket sizes have been added to the socket group numbers 1, 2 and 3, and twenty-two socket sizes have been added to the socket group number 4.
SDO IEC: International Electrotechnical Commission
Document Number IEC 60191
Publication Date Sept. 1, 2016
Language b - English & French
Page Count
Revision Level 2.0
Supercedes
Committee 47D
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