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IEC 60749-5 Ed. 3.0 b:2023

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

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IEC 60749-5 Ed. 3.0 b:2023

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

PUBLISH DATE 2023

Document Information

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

IEC 60749-5:2023 is available as IEC 60749-5:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition:
a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test;
b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment;
c) replacement of references to virtual junction with die.


SDO	IEC: International Electrotechnical Commission
Document Number	IEC 60749
Publication Date	Dec. 1, 2023
Language	b - English & French
Page Count	22
Revision Level	3.0
Supercedes
Committee	47

Publish Date	Document Id	Type
April 1, 2017	IEC 60749-5 Ed. 2.0 en:2017	Revision
Not Available		Revision
Not Available		Revision
Not Available		Revision
Dec. 1, 2023		Revision
Dec. 1, 2023	IEC 60749-5 Ed. 3.0 b:2023	Revision
Not Available	IEC 60749-5 Ed. 2.0 b:2017	Revision

SDO	Document	Title
BSI	BSI BS EN IEC 60749-5	Semiconductor devices. Mechanical and climatic test methods -- Steady-state temperature humidity bias life test
BSI	BSI BS EN 60749-38	Semiconductor devices. Mechanical and climatic test methods -- Soft error test method for semiconductor devices with memory
IEC	IEC 60749-38	Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
BSI	BSI BS EN 60749-5	Semiconductor devices. Mechanical and climatic test methods -- Steady-state temperature humidity bias life test
IEC	IEC 60749-4	Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
IEC	IEC 60749-42	Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
IEC	IEC 60749-36	Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state
IEC	IEC 60749-10	Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly
IEC	IEC 60749-23	Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
IEC	IEC 60749-41	Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices
IEC	IEC 60749-44	Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
BSI	BSI BS EN 60749-4	Semiconductor devices. Mechanical and climatic test methods -- Damp heat, steady state, highly accelerated stress test (HAST)
IEC	IEC 60749-28	Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
IEC	IEC 60749-37	Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
IEC	IEC 60749-40	Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
IEC	IEC 60749-34-1	Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module
BSI	BSI BS EN 60749-42	Semiconductor devices. Mechanical and climatic test methods -- Temperature and humidity storage
IEC	IEC 60749-25	Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
IEC	IEC 60749-11	Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
IEC	IEC 60749-15	Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
BSI	BSI BS EN 60749-36	Semiconductor devices. Mechanical and climatic test methods -- Acceleration, steady state
BSI	BSI BS EN IEC 60749-41	Semiconductor devices. Mechanical and climatic test methods -- Standard reliability testing methods of non-volatile memory devices
BSI	BSI BS EN IEC 60749-23	Semiconductor devices. Mechanical and climatic test methods -- High temperature operating life
BSI	BSI BS EN IEC 60749-10	Semiconductor devices. Mechanical and climatic test methods -- Mechanical shock. device and subassembly
BSI	BSI BS EN 60749-44	Semiconductor devices. Mechanical and climatic test methods -- Neutron beam irradiated single event effect (SEE) test method for semiconductor devices