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IEC 60749-5 Ed. 2.0 en:2017

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

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IEC 60749-5 Ed. 2.0 en:2017

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

PUBLISH DATE 2017

Document Information

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

IEC 60749-5:2017(E) provides a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments.
This second edition cancels and replaces the first edition published in 2003. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a)   correction of an error in an equation;
b)   inclusion of notes for guidance;
c)   clarification of the applicability of test conditions.


SDO	IEC: International Electrotechnical Commission
Document Number	IEC 60749
Publication Date	April 1, 2017
Language	en - English
Page Count
Revision Level	2.0
Supercedes
Committee	47

Publish Date	Document Id	Type
April 1, 2017	IEC 60749-5 Ed. 2.0 en:2017	Revision
Not Available		Revision
Not Available		Revision
Not Available		Revision
Dec. 1, 2023		Revision
Dec. 1, 2023	IEC 60749-5 Ed. 3.0 b:2023	Revision
Not Available	IEC 60749-5 Ed. 2.0 b:2017	Revision

SDO	Document	Title
IEC	IEC 60749-38	Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory
BSI	BSI BS EN IEC 60749-5	Semiconductor devices. Mechanical and climatic test methods -- Steady-state temperature humidity bias life test
BSI	BSI BS EN 60749-5	Semiconductor devices. Mechanical and climatic test methods -- Steady-state temperature humidity bias life test
BSI	BSI BS EN 60749-38	Semiconductor devices. Mechanical and climatic test methods -- Soft error test method for semiconductor devices with memory
IEC	IEC 60749-4	Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
IEC	IEC 60749-42	Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
IEC	IEC 60749-36	Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state
IEC	IEC 60749-10	Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly
IEC	IEC 60749-23	Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life
IEC	IEC 60749-41	Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices
IEC	IEC 60749-44	Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
BSI	BSI BS EN 60749-4	Semiconductor devices. Mechanical and climatic test methods -- Damp heat, steady state, highly accelerated stress test (HAST)
IEC	IEC 60749-28	Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level
IEC	IEC 60749-40	Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
IEC	IEC 60749-37	Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
IEC	IEC 60749-34-1	Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module
IEC	IEC 60749-25	Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
BSI	BSI BS EN 60749-42	Semiconductor devices. Mechanical and climatic test methods -- Temperature and humidity storage
IEC	IEC 60749-11	Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
IEC	IEC 60749-15	Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
BSI	BSI BS EN 60749-36	Semiconductor devices. Mechanical and climatic test methods -- Acceleration, steady state
BSI	BSI BS EN IEC 60749-41	Semiconductor devices. Mechanical and climatic test methods -- Standard reliability testing methods of non-volatile memory devices
BSI	BSI BS EN IEC 60749-23	Semiconductor devices. Mechanical and climatic test methods -- High temperature operating life
BSI	BSI BS EN IEC 60749-10	Semiconductor devices. Mechanical and climatic test methods -- Mechanical shock. device and subassembly
BSI	BSI BS EN 60749-44	Semiconductor devices. Mechanical and climatic test methods -- Neutron beam irradiated single event effect (SEE) test method for semiconductor devices