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BSI BS EN 61188-5-1:2002

Printed boards and assemblies. Design and use. Attachment (land/joint) considerations -- Attachment (land/joint) considerations. Generic requirements
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BSI BS EN 61188-5-1:2002

Printed boards and assemblies. Design and use. Attachment (land/joint) considerations -- Attachment (land/joint) considerations. Generic requirements

PUBLISH DATE 2003
PAGES 74
BSI BS EN 61188-5-1:2002
Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.
SDO BSI: British Standards Institution
Document Number EN 61188-5-1
Publication Date April 1, 2003
Language en - English
Page Count 74
Revision Level
Supercedes
Committee EPL/501
Publish Date Document Id Type View
April 1, 2003 BS EN 61188-5-1:2002 Revision