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BSI BS EN 61188-5-2:2003

Printed boards and assemblies. Design and use. Attachment (land/joint) considerations -- Discrete components
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BSI BS EN 61188-5-2:2003

Printed boards and assemblies. Design and use. Attachment (land/joint) considerations -- Discrete components

PUBLISH DATE 2003
PAGES 56
BSI BS EN 61188-5-2:2003
Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.
SDO BSI: British Standards Institution
Document Number EN 61188-5-2
Publication Date Oct. 16, 2003
Language en - English
Page Count 56
Revision Level
Supercedes
Committee EPL/501
Publish Date Document Id Type View
Oct. 16, 2003 BS EN 61188-5-2:2003 Revision