Logo
Login Sign Up
Current Revision

BSI BS EN 61188-5-6:2003

Printed boards and assemblies. Design and use. Attachment (land/joint) considerations -- Chip carriers with J-leads on four sides
Best Price Guarantee
Instant

$228.85

2-5 Days

$228.85

SAVE 10%

$411.93


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


or
British Standards Institution Logo

BSI BS EN 61188-5-6:2003

Printed boards and assemblies. Design and use. Attachment (land/joint) considerations -- Chip carriers with J-leads on four sides

PUBLISH DATE 2003
PAGES 22
BSI BS EN 61188-5-6:2003
Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.
SDO BSI: British Standards Institution
Document Number EN 61188-5-6
Publication Date June 26, 2003
Language en - English
Page Count 22
Revision Level
Supercedes
Committee EPL/501
Publish Date Document Id Type View
June 26, 2003 BS EN 61188-5-6:2003 Revision