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IEC 61188-6-4 Ed. 1.0 b:2019

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
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IEC 61188-6-4 Ed. 1.0 b:2019

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

PUBLISH DATE 2026
PAGES 86
IEC 61188-6-4 Ed. 1.0 b:2019
Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design.
The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.

SDO IEC: International Electrotechnical Commission
Document Number IEC 61188
Publication Date April 1, 2026
Language b - English & French
Page Count 86
Revision Level 1.0
Supercedes
Committee 91
Publish Date Document Id Type View
April 1, 2026 IEC 61188-6-4 Ed. 1.0 b:2019 Revision
May 1, 2019 Revision